The IGBT power cycling test system was developed to meet strict reliability requirements for power semiconductor devices used in areas like electric vehicles, renewable energy systems, and industrial drives. It simulates real-world on-off switching cycles of IGBTs, exposing components to repeated power and temperature fluctuations. Throughout testing, it continuously monitors key parameters such as conduction voltage drop, switching losses, and junction temperature variations. At the same time, it assesses potential mechanical issues like solder layer fatigue between the chip and the package. By combining precise control of thermal and electrical stress with detailed measurements, this equipment helps manufacturers evaluate lifespan, optimize designs, and confirm that IGBT devices maintain stable performance and reliability under demanding working conditions.